Sputtering is a process whereby atoms are ejected from a solid target material due to bombardment of the target by energetic ions. It is commonly used for thin-film deposition, etching and analytical techniques.

Sputtering is necessary to create a mirror surface on the face of  a compact disc so that it reflects the laser beam necessary for reading the data within the disc. This mirror surface is usually protected with a layer of  lacquer.

 

TARGET (ALUMINIUM, DISCGOLD, SILVER, SILICON, NICKEL ALLOY SILVER ALLOY)BALZERS (FOR BALZERS METALLIZERS)

ARQ900 (ALUMINIUM TARGET), (DISCGOLD TARGET)

ARQ912 (ALUMINIUM TARGET)

ARQ131 (SILICON TARGET)

ARQ920 (ALUMINIUM TARGET), (DISCGOLD TARGET), (SILVER TARGET)

ARQ930 (SILVER TARGET)

SINGULUS (FOR SINGULUS LINES)

SINGULUS 130 (ALUMINIUM TARGET), (DISCGOLD TARGET)

SINGULUS II (ALUMINUM TARGET), (DISCGOLD TARGET)

SINGULUS III (ALUMINIUM TARGET), (DISCGOLD TARGET)

SINGULUS III (SILICON TARGET)

SINGULUS III SMART (ALUMINIUM TARGET)

SINGULUS III SMART (SILVER TARGET)

M2 (FOR M2 LINES)

M2 -ML240127REVA (ALUMINIUM TARGET). (DISCGOLD TARGET))

M2- ML240187REVB (ALUMINIUM TARGET), (DISCGOLD TARGET) |

T4 (ALUMINIUM TARGET). (DISCGOLD TARGET)

T5 (ALUMINIUM TARGET) (DISCGOLD TARGET)

ODME (FOR ODME LINES)

ODME THICKEN |(ALUMINIUM TARGET),

(DISCGOLD TARGET)

ODME (ALUMINIUM TARGET), (DISCGOLD TARGET)

STEAG(FOR STEAG LINES)

STEAG 3503 (ALUMINIUM TARGET)

STEAG UNIJET (ALUMINIUM TARGET)

NOBLER (FOR NOBLER LINES)

NOBLER-6 HOLES (ALUMINIUM TARGET)

NOBLER-12 HOLES (ALUMINIUM TARGET) 

OTHERS

TAPEMETIC (ALUMINIUM TARGET)

4M MCL50  (ALUMINIUM TARGET)

SHIBAURA 7000 (ALUMINIUM TARGET)

S8 (ALUMINIUM TARGET)

NOVA 38A (ALUMINIUM TARGET)

(NICKEL ALLOY TARGET FOR MASTERING SYSTEM)

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Sputtering Target

  • Product Code: Sputtering Target
  • Availability: Pre-Order
  • USD0.00

  • Ex Tax: USD0.00

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